Avionics Mechanical Design & Analysis Engineer III - BNS Core Systems and Components Verified today
Avionics Mechanical Design & Analysis Engineer III
Core Systems & Components | Blue National Security | In-Space Systems business unit
The Role
Build the hardware that protects space missions. You'll own complex avionics packaging assemblies from requirements through production support, designing ruggedized enclosures and mechanical systems that shield sensitive electronics in the harsh space environment.
What You'll Do
- Own avionics packaging assemblies (enclosures, chassis, mounting systems) across the full lifecycle: requirements, design, analysis, verification, qualification, release, and production support
- Partner with electrical, systems, thermal, structures, manufacturing, quality, and test engineers to architect integrated packaging solutions for PCBAs, connectors, and harnessing
- Drive thermal, structural, vibration, shock, and fatigue analyses. Lead trade studies balancing mass, thermal/structural performance, EMI/EMC protection, manufacturability, cost, schedule, and risk
- Deliver high-quality models, drawings, specs, ICDs, and configuration-controlled release packages using GD&T per ASME Y14.5
- Shape environmental test campaigns end-to-end: planning, hardware prep, data review, anomaly investigation, root-cause analysis, and verification closeout
- Mentor less-experienced engineers, lead design reviews, and engage suppliers through design changes and configuration management
What You Bring
- B.S. in Mechanical, Aerospace, or related engineering discipline
- 5 or more years designing electromechanical assemblies, avionics packaging, or comparable aerospace hardware
- Track record owning mechanical designs across the full lifecycle, from requirements through production support
- Strong 3D CAD skills (Creo/Pro-E a plus) and solid command of GD&T and ASME Y14.5 drawing practices
- Experience integrating PCBAs, connectors, and cable/harness interfaces into mechanical assemblies
- Know-how in ruggedized design: thermal management, structural protection, vibration/shock survival, vacuum compatibility, EMI/EMC shielding
- Experience running or directing thermal and structural analyses for electronic packaging
- Independence to juggle multiple priorities, communicate technical risk clearly, and thrive cross-functionally
Bonus Qualifications
- M.S. in Mechanical, Aerospace, or related discipline
- Hands-on electronics thermal, structural, vibration, shock, or fatigue analysis experience (solder fatigue methods like Steinberg/Engelmaier a plus)
- FEA experience (ANSYS preferred)
- Windchill or similar PLM and configuration-management experience
- Harness design and workmanship know-how (IPC-A-620)
- Experience supporting environmental qualification/acceptance testing on aerospace or high-reliability hardware
- Background in spacecraft, human spaceflight, launch vehicle, or extreme-environment hardware development
- Track record mentoring junior engineers and leading design reviews
Compensation
Base pay range varies by location: CO applicants $119,814.00 to $167,738.55; WA applicants $130,706.00 to $182,987.70. Other site ranges may differ.
Requirements
Applicants must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Background checks required for all positions. Additional checks may apply based on role requirements including DBIDS if working on military installations.
Benefits
Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with company match up to 5%, Education Support Program. Stock options for all regular employees working at least 20 hours per week. Up to four weeks paid time off per year based on scheduled hours, plus up to 14 company-paid holidays.