Electrical Engineer, RF Payloads - Terawave Verified today

About TeraWave

Blue Origin is developing TeraWave, a revolutionary satellite communications network delivering symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation consists of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity worldwide.

What you will do

You will develop RF payload hardware for this next-generation constellation, acting as the critical engineering bridge integrating complex high-speed digital logic with advanced phased array antenna systems.

• Develop multi-layer, high-density interconnect (HDI) PCB design, ensuring strict isolation between high-speed digital lines and sensitive microwave routing
• Design highly efficient power systems (PoE, DC-DC converters, PMICs) capable of handling high dynamic current swings during beamforming operations
• Perform simulation and analysis to minimize noise, crosstalk, and electromagnetic interference (EMI) across the entire system
• Lead physical bring-up, hardware debugging, and functional lab testing of system-level boards

Required qualifications

• Bachelor's degree in electrical engineering or related technical field
• 3 or more years of experience in complex hardware product development (e.g., telecom hardware, 5G base stations, or aerospace electronics)
• Proficiency in EDA tools (e.g., Altium Designer, Cadence Allegro) with direct experience in schematic capture and layout guidelines for high-speed, multi-layer mixed-signal boards
• Hands-on experience using high-speed scopes, spectrum analyzers, and vector network analyzers (VNAs) for hardware debug
• Proven track record of supporting hardware through the entire lifecycle, from initial concept and design through integration, testing, and field operations

Preferred qualifications

• Master's degree in electrical engineering or related technical field
• Familiarity with satellite communication protocols (LEO/GEO systems) or commercial high-speed wireless infrastructure (5G sub-6GHz/mmWave, Wi-Fi 6E/7)
• Direct experience collaborating with antenna or RF specialists to co-design and optimize physical interfaces between PCBs and radiating elements (e.g., rigid-flex PCBs, board-to-board RF connectors)
• Experience designing hardware architecture around high-performance Xilinx/AMD Zynq SoCs, Altera/Intel FPGAs, or high-speed ARM processors
• Proven track record of designing for and successfully passing regulatory compliance testing (FCC Part 15/25, CE, ETSI) for intentional radiators
• Knowledge of thermal management strategies for high-power density boards and design practices for outdoor, weather-proof environments (IP67+ ratings)

Compensation and benefits

Base pay range for WA applicants: $107,136.00 - $149,990.40. Other site ranges may differ.

Benefits include medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with company match of up to 5%, and Education Support Program. Stock options for all regular employees working at least 20 hours per week. Paid time off up to four weeks per year based on scheduled hours, plus up to 14 company-paid holidays.

Employment requirements

Applicants must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum. Blue's Standard Background Check required for all positions.