Mechanical Engineer, RF Payloads - TeraWave Verified today

About the Role

Blue Origin is pioneering space-based communications with TeraWave, a multi-orbit satellite constellation delivering symmetrical data speeds up to 6 Tbps globally. This Mechanical Engineer III role leads mechanical engineering efforts for RF payload hardware, including phased array antenna structures and RF module packaging. You will act as the technical point of contact bridging mechanical design with RF and electrical engineering teams.

Responsibilities

• Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies.
• Direct thermal management strategies for high-power RF payload electronics, ensuring compliance with performance and reliability requirements.
• Perform structural and thermal analyses, including tolerance stack-ups, to validate RF payload mechanical designs.
• Lead architecture trade studies to define mechanical packaging approaches for RF payload hardware across programs.
• Serve as technical point of contact for RF payload mechanical design, coordinating with electrical and RF engineering teams.
• Provide technical leadership to suppliers and manufacturing partners on RF payload mechanical hardware producibility.
• Coordinate mechanical engineering efforts across programs to align RF payload packaging with electrical interfaces.
• Mentor junior and mid-level mechanical engineers on RF payload packaging design and analysis practices.

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering or related technical field.
• 6 or more years of experience in mechanical design and packaging of complex electronic hardware systems.
• Proficiency with 3D CAD tools such as CATIA, SolidWorks, or NX for assembly modeling.
• Experience performing structural and thermal analyses using analytical methods or finite element software tools.
• Experience applying GD&T principles and engineering drawing standards, including ASME Y14.5, in mechanical designs.

Preferred Qualifications

• Master's degree in Mechanical Engineering or related technical field.
• Knowledge of thermal management technologies, including heat sinks and thermal interface materials, for high-power RF hardware.
• Experience packaging RF hardware for space-qualified systems, including radiation, thermal vacuum, and vibration environments.
• Experience mentoring junior and mid-level mechanical engineers.
• Familiarity with phased array antenna mechanical integration, including panel-level packaging and beamforming module thermal design.
• Experience leading design for manufacturability and testability efforts with contract manufacturers for RF hardware production.
• Strong written and verbal communication skills.

Compensation and Location

Base pay range for CA and WA applicants: $121,023.00 to $169,432.20 annually. Other site ranges may differ.

Employment Requirements

Applicants must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Benefits

• Medical, dental, vision, basic and supplemental life insurance.
• Paid parental leave, short and long-term disability.
• 401(k) with company match up to 5%.
• Education Support Program.
• Stock options for regular employees working at least 20 hours per week.
• Paid time off: up to 4 weeks per year and up to 14 company-paid holidays.
• Eligibility for bonuses based on role type and job level at company discretion.