Mechanical Engineer, RF Payloads - TeraWave Verified today

About TeraWave

Blue Origin is pioneering space-based communications with TeraWave, a multi-orbit satellite constellation in low Earth orbit (LEO) and medium Earth orbit (MEO). The network will deliver symmetrical data speeds up to 6 Tbps with optically interconnected satellites.

The Role

As Mechanical Engineer III, you will lead mechanical engineering efforts for RF payload hardware supporting TeraWave, including phased array antenna structures and RF module packaging. You'll act as the technical point of contact bridging mechanical design with RF and electrical engineering teams, lead architecture trade studies, guide supplier and manufacturing decisions, and mentor junior engineers.

Key Responsibilities

• Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies
• Direct thermal management strategies for high-power RF payload electronics, ensuring compliance with performance and reliability requirements
• Perform structural and thermal analyses, including tolerance stack-ups, to validate RF payload mechanical designs
• Lead architecture trade studies to define mechanical packaging approaches for RF payload hardware across programs
• Serve as technical point of contact for RF payload mechanical design, coordinating closely with electrical and RF engineering teams
• Provide technical leadership to suppliers and manufacturing partners, ensuring producibility of RF payload mechanical hardware
• Coordinate mechanical engineering efforts across programs to align RF payload packaging requirements with electrical interfaces
• Mentor junior and mid-level mechanical engineers on RF payload packaging design and analysis practices

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering or a related technical field
• 6+ years of experience in mechanical design and packaging of complex electronic hardware systems
• Proficiency with 3D CAD tools, such as CATIA, SolidWorks, or NX, for assembly modeling
• Experience performing structural and thermal analyses using analytical methods or finite element software tools
• Experience applying GD&T principles and engineering drawing standards, including ASME Y14.5, in mechanical designs

Preferred Qualifications

• Master's degree in Mechanical Engineering or a related technical field, supporting advanced RF hardware design
• Knowledge of thermal management technologies, including heat sinks and thermal interface materials, for high-power RF hardware
• Experience packaging RF hardware for space-qualified systems, including radiation, thermal vacuum, and vibration environments
• Experience mentoring junior and mid-level mechanical engineers on RF payload packaging design and development practices
• Familiarity with phased array antenna mechanical integration, including panel-level packaging and beamforming module thermal design
• Experience leading design for manufacturability and testability efforts with contract manufacturers for RF hardware production
• Strong written and verbal communication skills, with the ability to present technical content to cross-functional stakeholders

Compensation

Base pay range for CA and WA applicants: $121,023.00 - $169,432.20. Other site ranges may differ.

Employment Details

Applicants must be a U.S. citizen or national, U.S. permanent resident (Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

A standard background check is required for all positions.

Benefits

• Medical, dental, vision, basic and supplemental life insurance
• Paid parental leave
• Short and long-term disability
• 401(k) with company match up to 5%
• Education Support Program
• Stock options for all regular employees (20+ hours/week)
• Up to four weeks paid time off per year based on scheduled hours
• Up to 14 company-paid holidays