Senior PCB Layout Engineer Verified today
About the Role
As part of the RF User Terminal Design team, you will design complex PCBs with thousands of high-ball-count custom BGA devices featuring mmWave, RF, and mixed-signal interconnects. You'll conduct PCB stackup feasibility and trace routability studies to inform key architectural trades, and lead the PCB OK2FAB process including DRC checks, design release, and fabrication drawing preparation.
Responsibilities
- Design multi-layer PCBs for mmWave and microwave RF, complex digital, mixed-signal and high power systems including FPGAs and microcontrollers
- Develop PCB layouts for digital, analog and RF circuits with attention to impedance control, loss tangent, and electromagnetic compatibility
- Perform signal integrity analysis for high-speed digital interfaces (PCIe, DDR, Ethernet)
- Create component libraries, design rule checks (DRCs), and maintain design standards
- Collaborate with electrical engineers on component selection, schematic review, and design optimization
- Generate fabrication and assembly documentation including Gerber files, drill files, and assembly drawings
- Work with PCB fabricators and CM vendors to ensure manufacturability and resolve fabrication issues
- Support board bring-up activities and debug hardware issues related to PCB design
- Design for space environment considerations including thermal management, radiation tolerance, and mechanical stress
Minimum Qualifications
- B.S. in Electrical Engineering, Computer Engineering, or related field with 5 or more years of PCB design experience
- Proficiency with PCB design tools (Altium Designer preferred, Cadence Allegro, or similar)
- Strong understanding of signal integrity principles for high-speed digital design (transmission lines, termination, crosstalk)
- Experience with higher layer count HDI board design with dense fanout and routing
- Experience with controlled impedance design and PCB stackup optimization
- Experience with high voltage layout design including creepage clearance and thermal management
- Knowledge of EMI/EMC best practices and design guidelines
- Familiarity with IPC standards (IPC-2221, IPC-6012, IPC-A-610)
- Experience with PCB layout for FPGAs, high-speed ADCs/DACs, or mixed-signal designs
Preferred Qualifications
- Experience with RF/microwave PCB design using high-frequency laminates (Rogers, Taconic, etc.)
- Knowledge of power integrity analysis tools (HyperLynx, Ansys SIwave, Cadence Sigrity)
- Familiarity with thermal analysis tools and thermal management techniques for high-power electronics
- Experience designing for space environment (vacuum, thermal cycling, radiation, vibration)
- Understanding of design for manufacturing (DFM) and design for test (DFT) principles
- Knowledge of conformal coating, potting, and other space-qualification techniques
- Previous experience with aerospace or satellite PCB designs
- Familiarity with MIL-STD or NASA standards for PCB design
Compensation
Base pay range for CA, VA, and WA applicants: $197,529.00 to $276,539.55 annually. Other site ranges may differ.
Employment Details
U.S. citizenship or national status, U.S. permanent resident status, or lawful refugee/asylum status required. Background check required for all positions.
Benefits
- Medical, dental, vision, life insurance
- Paid parental leave, short and long-term disability
- 401(k) with company match up to 5%
- Education Support Program
- Stock options for regular employees (20+ hours/week)
- Up to four weeks paid time off annually and up to 14 company-paid holidays
