Sr. Mechanical Engineer - Avionics Mechanical Packaging - TeraWave Verified today
About the role
Blue Origin is developing TeraWave, a satellite communications network delivering symmetrical data speeds up to 6 Tbps anywhere on Earth. This multi-orbit constellation of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO) will provide enterprise-grade connectivity worldwide.
As Sr. Mechanical Engineer for the TeraWave Spacecraft Bus, you will drive requirements, design, analysis, test, and critical review of avionics enclosures and assemblies that house electronic components. You will own mechanical packaging for Line Replaceable Units (LRU) including enclosure design, card retention, thermal paths, connector access, mounting interfaces, serviceability, mass optimization, producibility, and integration flow.
Responsibilities
- Participate in the full design cycle of flight and mission-critical avionics Line Replacement Units (LRUs)
- Design and develop packaging architectures using DFM/DFA principles for avionics LRU enclosures
- Design avionics enclosure solutions for performance and high reliability in harsh environments
- Create mechanical interface definitions, specifications, and control documents
- Create 3D CAD models and assemblies, part and assembly drawings, installation drawings, and technical documentation
- Collaborate with electrical engineering teams to incorporate printed circuit boards and interconnect systems, including thermal and structural analyses
- Own Bills of Materials (BOMs) and configuration control throughout the product lifecycle
- Build and evaluate prototype assemblies
- Create assembly aids and test fixtures
- Plan and conduct engineering tests and data reviews
- Review assembly instructions and support hardware builds
- Support environmental testing (TVAC, thermal cycling, vibration, shock) including test setup, instrumentation, data review, and corrective actions
- Support Production and Quality Engineering, including dispositioning material defects
- Manage product design configuration revisions through the lifecycle
Minimum qualifications
- B.S. degree in mechanical or aerospace engineering
- 7+ years of recent experience designing ruggedized electronic enclosures or similar high-performance, high-reliability hardware
- Familiarity with static structural, modal, random vibration, and thermal analysis
- Proficiency with 3D CAD and drawings (Creo, NX, or SolidWorks); strong GD&T (ASME Y14.5) and tolerance analysis
- Experience with environmental testing including vibration, shock, and thermal cycling
- Experience performing failure analysis and establishing root cause and corrective action
- Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum
Preferred qualifications
- Experience with avionics, power regulators and distributors, or battery packaging disciplines
- Experience with aerospace, launch vehicle, or spacecraft avionics systems
- Experience with FEA tools (Ansys preferred)
- Experience with recent versions of Creo, Windchill, and Ansys Mechanical
- Experience with fatigue analysis and fracture mechanics
- Experience with additional environmental testing including EMI/RFI and TVAC
- Ability to be self-directed and balance multiple projects
Compensation
Base pay range varies by location:
- CA applicants: $145,188.00 - $203,263.20
- CO applicants: $133,500.00 - $186,898.95
- WA applicants: $145,188.00 - $203,263.20
- Other site ranges may differ
Benefits
- Medical, dental, vision, basic and supplemental life insurance
- Paid parental leave
- Short and long-term disability
- 401(k) with company match up to 5%
- Education Support Program
- Stock options for all regular employees (working at least 20 hours/week)
- Paid time off: up to four weeks per year based on scheduled hours, plus up to 14 company-paid holidays