Sr. Mechanical Engineer – Avionics Packaging - TeraWave Verified today
About the Role
Blue Origin is developing TeraWave, a revolutionary satellite communications network delivering symmetrical data speeds up to 6 Tbps anywhere on Earth. The constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO).
As a Senior Mechanical Engineer on the TeraWave Spacecraft Bus, you will drive requirements, design, analysis, test, and critical review of avionics enclosures and assemblies. You will own mechanical packaging for Line Replaceable Units (LRUs), including enclosure design, card retention, thermal paths, connector access, mounting interfaces, serviceability, mass optimization, producibility, and integration flow. Your work will span concept through formal qualification and verification, including integration and flight support.
Responsibilities
- Participate in the entire design cycle of flight and mission critical avionics LRUs
- Design and develop packaging architectures using DFM and DFA for avionics LRU enclosures
- Design avionics enclosure solutions for performance and high reliability in harsh environments
- Create mechanical interface definitions, specifications, and control documents
- Create 3D CAD models, assemblies, part drawings, assembly drawings, and installation drawings
- Collaborate with electrical engineering on printed circuit board and interconnect systems, including thermal and structural analyses
- Own bills of materials and configuration control throughout the product lifecycle
- Build and evaluate prototype assemblies
- Create assembly aids and test fixtures
- Plan and conduct engineering tests and data reviews
- Review assembly instructions and support hardware builds
- Support environmental testing (TVAC, thermal cycling, vibration, shock): test setup, instrumentation, data review, and corrective actions
- Support Production and Quality Engineering, including dispositioning material defects
- Manage product design configuration revisions through the product lifecycle
Minimum Qualifications
- Bachelor's degree in mechanical or aerospace engineering
- 7 or more years of recent experience designing ruggedized electronic enclosures or similar high-performance and high-reliability hardware
- Familiarity with static structural, modal, random vibration, and thermal analysis
- Proficiency with 3D CAD and drawings (Creo, NX, or SolidWorks); strong GD&T (ASME Y14.5) and tolerance analysis
- Experience with environmental testing including vibration, shock, and thermal cycle
- Experience performing failure analysis and establishing root cause and corrective action
- Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum
Preferred Qualifications
- Experience with avionics, power regulators and distributors, or batteries packaging
- Experience with aerospace, launch vehicle, or spacecraft avionics systems
- Experience with FEA tools (Ansys preferred)
- Experience with recent versions of Creo, Windchill, or Ansys Mechanical
- Experience with fatigue analysis and fracture mechanics
- Experience with additional environmental testing including EMI/RFI and TVAC
- Ability to be self-directed and balance multiple projects
Compensation
Base pay range varies by location:
- California: $145,188.00 to $203,263.20
- Colorado: $133,500.00 to $186,898.95
- Washington: $145,188.00 to $203,263.20
Other site ranges may differ.
Benefits
- Medical, dental, vision coverage
- Basic and supplemental life insurance
- Paid parental leave
- Short and long-term disability
- 401(k) with company match up to 5%
- Education Support Program
- Stock options for all regular employees (20+ hours per week)
- Paid time off: up to four weeks per year and up to 14 company-paid holidays
- Bonuses may be available based on role, level, and company discretion