Sr. Signal Integrity Engineer – High-Speed Digital / RF Verified today
About the role
Blue Origin is pioneering TeraWave, a revolutionary satellite communications network delivering symmetrical data speeds up to 6 Tbps. This multi-orbit constellation uses optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO).
You will own end-to-end channel design and validation for next-generation high-speed digital and RF systems, including advanced optical and RF interconnects. Your work spans simulation and modeling through PCB stackup definition, calibration structures, and lab characterization up to approximately 70 GHz.
Key Responsibilities
- Lead SI analysis for high-speed serial links and RF interconnects up to approximately 70 GHz
- Use HFSS to model interconnects, packages, transitions, and antenna-adjacent structures
- Use ADS for linear and nonlinear circuit modeling, S-parameter work, and trade studies
- Build, adapt, and correlate IBIS-AMI models with measurements and full-wave simulations
- Define PCB stackups, materials, impedance targets, and routing rules for SI-robust designs
- Design SOLT/TRL structures, coupons, and procedures for VNA/TDR workflows
- Measure and correlate S-parameters, loss, isolation, and channel performance across simulation and hardware
- Diagnose and resolve SI issues including reflections, resonances, crosstalk, and mode conversion
- Produce clear reports, guidelines, and review material for cross-functional teams
Basic Qualifications
- Bachelor's degree in Electrical or Electronics Engineering or related field
- 5 or more years in signal integrity, high-speed digital, or RF/microwave design
- Proficiency with HFSS, ADS, and IBIS-AMI workflows
- Experience defining PCB stackups for high-speed and microwave designs
- Hands-on VNA and TDR measurement experience
- Strong understanding of transmission lines, S-parameters, loss mechanisms, jitter, crosstalk, and channel budgeting
- Ability to work across RF, digital, packaging, and systems teams
Preferred Qualifications
- Master's degree in EE or related field
- Experience designing or characterizing channels and interconnects up to approximately 70 GHz
- Background in antenna-adjacent PCB design (arrays, feed networks, front-end modules)
- Experience with package-to-PCB co-design
- Familiarity with scripting (Python, MATLAB) for SI automation
- Experience correlating BER/margin results to SI simulations
- Exposure to space and aerospace hardware and reliability constraints
Compensation and Work
Base pay range: $230,773.00 to $323,081.85 (for CA and WA applicants; other site ranges may differ).
Willingness to support occasional off-hours testing or lab work as project schedules require.
Requirements
You must be a U.S. person (U.S. citizen, national, permanent resident, or lawfully admitted as a refugee or asylum grantee) as required by applicable export control laws.