AstroTalentSpace Jobs

Senior ASIC Package Design Engineer Verified today

K2 Space · United States · Electronics · first seen 2026-09-16
Apply at K2 Space →

The Role

We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. You will support the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will collaborate with internal teams for package design, define standards, influence silicon and system architecture, and ensure first-pass success for complex, high-speed, power-dense ASICs.

Responsibilities

  • Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Establish package design standards, methodologies, and best practices.
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
  • Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy.
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
  • Manage relationships with external packaging vendors, substrate suppliers, and OSATs.
  • Drive material selection, substrate technology choices, and assembly process optimization.

Qualifications

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies.

Nice to Have

  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
  • Background in high-speed digital or mixed-signal SoCs.
  • Familiarity with aerospace, space, or high-reliability electronics.

Compensation and Benefits

  • Base salary range: $180,000 - $260,000 + equity in the company
  • Salary based on knowledge, skills, education, and experience level
  • Comprehensive benefits including paid time off, medical/dental/vision coverage, life insurance, paid parental leave, and additional perks

Export Compliance

This role requires access to information and items controlled by U.S. export control regulations, including ITAR. You must be a U.S. Person as defined by 22 C.F.R. § 120.15 (U.S. citizen, lawful permanent resident, or protected individual such as refugee/asylee or American Samoan) or otherwise eligible for a federally issued export control license.