AstroTalentSpace Jobs

Supplier Development Engineer, PCB (Starlink) Verified today

SpaceX · Bastrop, TX · Electronics · first seen 2026-09-03
Apply at SpaceX →

About the Role

Starlink User Terminal is growing rapidly across consumer, retail, enterprise, and mobility applications. We need a technically strong engineer to drive supplier selection, development, qualification, and scaling for the PCB portfolio that forms the foundation of our User Terminals.

You will execute supplier strategies for bare PCBs, multilayer boards, high-frequency and RF PCBs, and related raw materials. This role requires hands-on technical capability, manufacturing knowledge, and the ability to collaborate across Starlink engineering, quality, and supply chain teams to mature suppliers for aggressive growth targets.

What You Will Own

  • Supplier development activities for the PCB portfolio within Starlink User Terminal Bill of Materials, with primary focus on incoming PCB supply chain quality and reliability.
  • Build and maintain a resilient, high-quality, and scalable supply base capable of supporting high-volume production ramp and sustained growth.
  • Assess supplier manufacturing capabilities including production capacity, process stability, equipment suitability, process windows, material control, and technical readiness for lamination, drilling, plating, etching, solder mask, surface finishes, impedance control, and automated testing.
  • Lead Production Part Approval Process (PPAP), First Article Inspections (FAI), production rate ramps, and reliability campaigns to enable high-volume manufacturing.
  • Develop and execute robust qualification plans tailored to PCBs, including dimensional and electrical verification, RF performance testing, thermal and mechanical reliability demonstration, and compliance to applicable standards.
  • Create and standardize qualification protocols across the PCB supply base, including equipment buy-off checklists, Factory Acceptance Tests (FAT), Site Acceptance Tests (SAT), and consistent reliability demonstration methods.
  • Drive supplier performance improvement through Lean methodologies, supplier scorecards, process audits, and systematic problem solving to deliver measurable gains in quality, cost, and on-time delivery.
  • Perform root cause analysis and lead corrective actions for quality issues, with focus on common PCB defect modes such as delamination, plating voids, open or short circuits, warpage, copper thickness variation, solder mask defects, impedance drift, CAF (conductive anodic filament), pad cratering, and material-related reliability issues.
  • Partner closely with Design Engineering, Reliability Engineering, RF and Electrical teams, and Production to ensure supplier processes align with Starlink's high-volume product requirements and performance goals.
  • Support continuous improvement of supplier quality systems and manufacturing processes to meet escalating volume, cost, and reliability targets for standard and high-frequency RF PCBs used in indoor and outdoor-rated products.
  • Qualify new suppliers and manage ongoing performance of the incoming PCB supply base.

Basic Qualifications

  • Bachelor's degree in Electrical Engineering, Material Science, RF Engineering, or a related engineering discipline.
  • 3 or more years of experience in PCB engineering, quality engineering, reliability engineering, or supplier development.

Preferred Skills and Experience

  • Strong technical background in manufacturing processes, materials, quality systems, and high-volume electronics production.
  • Hands-on knowledge of high-volume PCB manufacturing processes including multilayer lamination, mechanical or laser drilling, electroless and electrolytic plating, etching, solder mask application, surface finishes (ENIG, HASL, OSP), impedance control, and automated inspection and testing.
  • Experience with PPAP, APQP, PFMEA, DFMEA, and First Article Inspection specifically for PCBs and electronic interconnects.
  • Familiarity with IPC standards such as IPC-A-600, IPC-6012, IPC-6013, IPC-4101, IPC-4552, IPC-TM-650 and related quality and reliability standards.
  • Understanding of PCB reliability, common defect modes, failure analysis techniques, and material science aspects of laminates, copper foils, and finishes.
  • Experience qualifying rigid, flex, rigid-flex, and high-frequency RF PCBs for high-volume production, including controlled impedance, high-speed digital, and RF performance requirements.
  • Understanding of manufacturing capability evaluations, including capacity analysis, Cp and Cpk process capability studies, process window validation, and scalability for high-volume PCB production.
  • Problem-solving skills using 8D, 5-Why, fishbone analysis, and statistical methods such as JMP, Design of Experiments, and Six Sigma.
  • Knowledge of reliability engineering practices such as accelerated life testing, thermal cycling, humidity exposure, thermal shock, CAF testing, and PCB-specific failure mechanism analysis.
  • Ability to read and interpret 2D drawings, Gerber and ODB++ files, stack-up designs, material specifications, and performance requirements.
  • Experience with Lean manufacturing concepts, supplier scorecard systems, and high-volume process capability assessment.
  • Excellent written and verbal communication skills with ability to distill complex technical topics into clear one-pagers and presentations.
  • Demonstrated ability to influence cross-functional teams and suppliers in a fast-paced, high-growth environment.

Additional Requirements

  • Ability to travel up to 25% of the time, both domestically and internationally.
  • Position may require extended working hours and occasional weekends to support production ramps and critical issue resolution.
  • ITAR requirements: Applicant must be a U.S. citizen or national, U.S. lawful permanent resident (green card holder), Refugee under 8 U.S.C. § 1157, or Asylee under 8 U.S.C. § 1158, or be eligible to obtain required authorizations from the U.S. Department of State.